POWER8E
Revision as of 21:16, 24 April 2019 by Olddellian (talk | contribs) (adding terminology from https://www.nextplatform.com/2018/08/28/ibm-power-chips-blur-the-lines-to-memory-and-accelerators/)
| POWER8E | |
|---|---|
| Power ISA | 2.07 |
| Process node | 22nm |
| Maximum slices | 12 |
| Maximum cores | 12 SMT8 |
| L2 cache / slice | 512kB |
| L3 cache / slice | 8MB |
| Production availability | 2016 |
| Production stepping(s) | DD2.1 |
| ← POWER8 | POWER9 → |
POWER8E (also known as POWER8 with NVLink, POWER8’ (with a prime symbol), 8335-GTB POWER8, or POWER8+) processors have a different socket than standard POWER8 chips.
Compared to a standard POWER8 Single Chip Module (SCM), the POWER8 with NVLink modifies:
- 2nd CAPP unit added, X2 removed
- x8 PHB
- x8 IOP
- A-bus removed, NVLink added
- NVLink support added in extended ES
- Chip height: 2 C4 rows added
Without A-bus or SMP over PCIe, the processors in a multisocket configuration instead use X-Bus for SMP. The chip size is 659 mm2, rather than 649 mm2 for POWER8, and only available for the S822LC for HPC, specifically the 8335-GTB model. [1][2]
External Links
References
- ↑ Caldeira, Alexandre Bicas; Haug, Volker. IBM Power System S822LC for High Performance Computing Introduction and Technical Overview (PDF). IBM Redpaper. ISBN 9780738455617.
- ↑ Gupta, Sumit. IBM & NVIDIA present the NVLink server you’ve been waiting for (HTML). 2016-09-08. IBM IT Infrastructure Blog.
