Difference between revisions of "POWER9"
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Chips are planned to be made in both [[Scale Out|Scale Out]] (direct-attach RAM) and [[Scale Up|Scale Up]] (centaur-buffered RAM) configurations; where a Scale Out system can use normal RAM attached directly to the CPU, Scale Up chips require that access to RAM be through a Centaur memory buffer, which behaves like a L4 cache.<ref>Stuecheli, Jeff. POWER9. Presentation for [https://www.ibm.com/developerworks/community/wikis/home?lang=en#!/wiki/Power+Systems/page/AIX+Virtual+User+Group+-+USA AIX VUG]. ([https://public.dhe.ibm.com/systems/power/community/aix/Central-VUG-Replays/2017-01-26_IBM_POWER9.wmv video download], [https://www.ibm.com/developerworks/community/wikis/form/anonymous/api/wiki/61ad9cf2-c6a3-4d2c-b779-61ff0266d32a/page/1cb956e8-4160-4bea-a956-e51490c2b920/attachment/56cea2a9-a574-4fbb-8b2c-675432367250/media/POWER9-VUG.pdf slides], [[User:Torpcoms/Timemark/POWER9|timemarks]])</ref> | Chips are planned to be made in both [[Scale Out|Scale Out]] (direct-attach RAM) and [[Scale Up|Scale Up]] (centaur-buffered RAM) configurations; where a Scale Out system can use normal RAM attached directly to the CPU, Scale Up chips require that access to RAM be through a Centaur memory buffer, which behaves like a L4 cache.<ref>Stuecheli, Jeff. POWER9. Presentation for [https://www.ibm.com/developerworks/community/wikis/home?lang=en#!/wiki/Power+Systems/page/AIX+Virtual+User+Group+-+USA AIX VUG]. ([https://public.dhe.ibm.com/systems/power/community/aix/Central-VUG-Replays/2017-01-26_IBM_POWER9.wmv video download], [https://www.ibm.com/developerworks/community/wikis/form/anonymous/api/wiki/61ad9cf2-c6a3-4d2c-b779-61ff0266d32a/page/1cb956e8-4160-4bea-a956-e51490c2b920/attachment/56cea2a9-a574-4fbb-8b2c-675432367250/media/POWER9-VUG.pdf slides], [[User:Torpcoms/Timemark/POWER9|timemarks]])</ref> | ||
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| + | === Markings === | ||
| + | |||
| + | There does not appear to be any way to distinguish a 4-core chip from an 8-core chip by looking at the markings on the top (HSF-facing) surface of the module. | ||
== Modules == | == Modules == | ||
Revision as of 05:39, 19 September 2018
| POWER9 | |
|---|---|
| Power ISA | 3.0B |
| Process node | 14nm |
| Maximum slices | 24 |
| Maximum cores | 12 SMT8 / 24 SMT4 |
| L2 cache / slice | 512kB |
| L3 cache / slice | 10MB |
| Production availability | January 2018 |
| Production stepping(s) | DD2.2 |
| ← POWER8E | POWER10 → |
POWER9 is IBM's most recent POWER compatible server and workstation CPU (POWER ISA v3.0B). Built on a 14nm process, each CPU package can contain up to 24 SMT4 cores or 12 SMT8 cores. Each pair of SMT4 cores, or singleton SMT8 core, comprises a slice; each slice in turn contains 512kB L2 cache and 10MB L3 cache. Raptor Computing Systems' 4- and 8-core processors provide unpaired cores, such that one SMT4 core per slice is fused off. This allows each of the SMT4 cores to utilize the full cache of the slice exclusively, increasing performance for these ST-focused processors.
Contents
Chips
| PowerNV | PowerVM | |
|---|---|---|
| Scale Out | Nimbus | unknown[note 1] |
| Scale Up | Cumulus |
- ↑ The presentation by Jeff Stuecheli makes it clear that these chips will exist, but the codename for them is currently unknown.
PowerNV chips use SMT4 cores exclusively, and are intended to run Linux on bare metal as an OpenPOWER system. PowerVM chips, in contrast, use SMT8 cores, and are intended to run Linux, AIX, or IBM i under IBM's PowerVM hypervisor.
Chips are planned to be made in both Scale Out (direct-attach RAM) and Scale Up (centaur-buffered RAM) configurations; where a Scale Out system can use normal RAM attached directly to the CPU, Scale Up chips require that access to RAM be through a Centaur memory buffer, which behaves like a L4 cache.[1]
Markings
There does not appear to be any way to distinguish a 4-core chip from an 8-core chip by looking at the markings on the top (HSF-facing) surface of the module.
Modules
| Chip | Module |
|---|---|
| Nimbus | Sforza |
| Monza | |
| LaGrange | |
| (PowerVM Scale Out) |
unknown |
| Cumulus | unknown |
Nimbus
Nimbus chips are available in three different modules: Sforza, Monza, and LaGrange. Each module exposes different I/O functionality to the host platform, allowing purpose-built systems to be constructed in addition to more general-purpose computers.
Sforza
Sforza is the most flexible of these packages, providing PCIe 4.0 lanes as the main I/O resource, and is what Talos™ II uses for maximal similarity to existing desktop, workstation, and server systems.
Monza
Monza modules offer the most OpenCAPI/NVLink bandwidth and are used in IBM's AC922 (Witherspoon) systems, such as those used by the Sierra and Summit supercomputers.
LaGrange
LaGrange modules offer increased XBus bandwidth between processor sockets and are used by the Google/Rackspace Zaius motherboard used in the Barreleye G2 system.[2]
Cumulus
Little is known about Cumulus chips now; as Scale Up chips, they will trade some peripherals bandwidth for communication between more than 2 sockets.[3]
References
- ↑ Stuecheli, Jeff. POWER9. Presentation for AIX VUG. (video download, slides, timemarks)
- ↑ Gangidi, Adi Zaius/Barreleye G2 Server Development Update. 2017-11-13
- ↑ Morgan, Timothy Prickett. POWER9 to the People. 2017-12-05
Resources
- Basic POWER9 overview presentation
- Power ISA version 3.0B - implemented by POWER9
