Difference between revisions of "LaGrange"
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|data2 = [[POWER9|POWER9]] | |data2 = [[POWER9|POWER9]] | ||
|label3 = Chip | |label3 = Chip | ||
− | |data3 = Nimbus | + | |data3 = [[Nimbus]] |
|label4 = Maximum base clock | |label4 = Maximum base clock | ||
|data4 = - | |data4 = - | ||
Line 30: | Line 30: | ||
}} | }} | ||
− | '''LaGrange''' is the codename for a POWER9 CPU module/package; it represents a middle ground between the PCIe-only peripheral connectivity of the the Sforza module, and the maximum OpenCAPI/NVLink connectivity of the Monza module. However, LaGrange also has twice the Xbus (socket-socket) bandwidth of these modules. | + | ''For more general information about the Nimbus chip this module contains, such as details about particular steppings, please see [[Nimbus|Nimbus]].'' |
+ | |||
+ | '''LaGrange''' is the codename for a [[POWER9]], [[Nimbus]] chip, CPU module/package; it represents a middle ground between the PCIe-only peripheral connectivity of the the [[Sforza]] module, and the maximum OpenCAPI/NVLink connectivity of the [[Monza]] module. However, LaGrange also has twice the Xbus (socket-socket) bandwidth of these modules. | ||
LaGrange is used by the Google/Rackspace Zaius/Barreleye G2 board. | LaGrange is used by the Google/Rackspace Zaius/Barreleye G2 board. | ||
Line 40: | Line 42: | ||
! Part | ! Part | ||
! Cores | ! Cores | ||
− | ! Stepping | + | ! [[Nimbus#Steppings|Stepping]] |
! Nest/Boost/Base (GHz) | ! Nest/Boost/Base (GHz) | ||
! Max | ! Max | ||
|- | |- | ||
| 02CY069 | | 02CY069 | ||
− | | 22 | + | |rowspan=2| 22 |
− | | | + | | DD2.2 |
− | | 2.00/3.80/2.90 | + | |rowspan=2| 2.00/3.80/2.90 |
− | | 225 W | + | |rowspan=2| 225 W |
+ | |- | ||
+ | | 02CY574 | ||
+ | | DD2.3 | ||
|- | |- | ||
| 02CY254 | | 02CY254 | ||
− | | 20 | + | |rowspan=2| 20 |
− | | | + | | DD2.2 |
− | | 2.00/3.80/2.90 | + | |rowspan=2| 2.00/3.80/2.90 |
− | | 225 W | + | |rowspan=2| 225 W |
+ | |- | ||
+ | | 02CY582 | ||
+ | | DD2.3 | ||
|- | |- | ||
| 02CY249 | | 02CY249 | ||
− | | 16 | + | |rowspan=3| 16 |
− | | | + | | DD2.2 |
− | | 2.00/3. | + | | 2.00/3.90/3.40 |
− | | 225 W | + | |rowspan=3| 225 W |
+ | |- | ||
+ | | 02CY584 | ||
+ | | DD2.3 | ||
+ | | 2.00/4.00/3.35 | ||
+ | |- | ||
+ | | 02AA947 | ||
+ | | DD2.1 | ||
+ | | 2.00/3.80/2.95 | ||
|- | |- | ||
| 02CY057 | | 02CY057 | ||
− | | 18 | + | |rowspan=2| 18 |
− | | | + | | DD2.2 |
+ | |rowspan=2| 2.00/3.80/2.80 | ||
+ | |rowspan=2| 190 W | ||
+ | |- | ||
+ | | 02CY575 | ||
+ | | DD2.3 | ||
+ | |- | ||
+ | | 02WP188 | ||
+ | | 12 | ||
+ | | DD2.3 | ||
| 2.00/3.80/2.80 | | 2.00/3.80/2.80 | ||
− | | | + | | 160 W |
|} | |} | ||
− | Sourced from [[:File:POWER9 LaGrange ds v17 28MAR2019 pub.pdf|LaGrange data sheet]] (see Table 6-10 on page 66 | + | Sourced from [[:File:POWER9 LaGrange ds v17 28MAR2019 pub.pdf|LaGrange data sheet v1.7]] (see Table 6-10 on page 66) and [[:File:POWER9 LaGrange ds v18 14AUG2019 pub.pdf|LaGrange data sheet v1.8]] (see Table 6-10 on page 66). |
== See Also == | == See Also == | ||
Line 79: | Line 104: | ||
* [https://www-355.ibm.com/systems/power/openpower/tgcmDocumentRepository.xhtml?aliasId=POWER9_LaGrange LaGrange Module at IBM OpenPOWER portal] | * [https://www-355.ibm.com/systems/power/openpower/tgcmDocumentRepository.xhtml?aliasId=POWER9_LaGrange LaGrange Module at IBM OpenPOWER portal] | ||
+ | * [https://en.wikichip.org/wiki/ibm/cores/lagrange WikiChip page for LaGrange] | ||
[[Category:Modules]] | [[Category:Modules]] | ||
[[Category:POWER9]] | [[Category:POWER9]] |
Latest revision as of 08:54, 6 September 2022
LaGrange | |
---|---|
Processor | POWER9 |
Chip | Nimbus |
Maximum base clock | - |
Maximum WOF clock | - |
Maximum TDP | - |
PCIe controllers (PEC) | - |
PCIe generation | 4 |
Maximum PCIe lanes | 42 |
Maximum PCIe endpoints | - |
CAPI 2.0 interfaces | - |
OpenCAPI/NVLink lanes | 16 |
OpenCAPI interfaces | 2 |
NVLink interfaces | 1 |
For more general information about the Nimbus chip this module contains, such as details about particular steppings, please see Nimbus.
LaGrange is the codename for a POWER9, Nimbus chip, CPU module/package; it represents a middle ground between the PCIe-only peripheral connectivity of the the Sforza module, and the maximum OpenCAPI/NVLink connectivity of the Monza module. However, LaGrange also has twice the Xbus (socket-socket) bandwidth of these modules.
LaGrange is used by the Google/Rackspace Zaius/Barreleye G2 board.
LaGrange will be used for the upcoming RCS Condor board, albeit in a single-socket configuration.
Part | Cores | Stepping | Nest/Boost/Base (GHz) | Max |
---|---|---|---|---|
02CY069 | 22 | DD2.2 | 2.00/3.80/2.90 | 225 W |
02CY574 | DD2.3 | |||
02CY254 | 20 | DD2.2 | 2.00/3.80/2.90 | 225 W |
02CY582 | DD2.3 | |||
02CY249 | 16 | DD2.2 | 2.00/3.90/3.40 | 225 W |
02CY584 | DD2.3 | 2.00/4.00/3.35 | ||
02AA947 | DD2.1 | 2.00/3.80/2.95 | ||
02CY057 | 18 | DD2.2 | 2.00/3.80/2.80 | 190 W |
02CY575 | DD2.3 | |||
02WP188 | 12 | DD2.3 | 2.00/3.80/2.80 | 160 W |
Sourced from LaGrange data sheet v1.7 (see Table 6-10 on page 66) and LaGrange data sheet v1.8 (see Table 6-10 on page 66).